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TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power

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TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power

TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power
TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power

Large Image :  TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power

Product Details:
Place of Origin: Beijing
Brand Name: Cansec Wireless
Model Number: AN1312UA-A
Payment & Shipping Terms:
Minimum Order Quantity: 100
Price: USD 5.46$ per piece
Packaging Details: Box for 1000 pieces Package size: 40*34*20 cm Gross weight: 5.000 kg
Delivery Time: 5~8 weeks
Payment Terms: T/T
Supply Ability: 2000000 pieces per year

TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power

Description
Size: 15mm*22mm*3.2mm TX Power: 13dBm
RX Sensitivity: -124dBm TX Current: 25mA
RX Current: 5.5mA Standby Current: 1uA
Antenna: UFL Connector Chipset: CC1312 By Texas Instruments
Frequency: 434/470/868/915MHz Reach: 800m Max
Working Tempurature: -20~+70℃
Highlight:

AES 256 Bits Sub GHz Module

,

TI CC1312 IoT Sub GHz Module

,

434MHz CC1312 Module

Cansec Long Range AN1312 TI - CC1312 Sub-GHz IoT Module AES 256bits Low Power Consumption Module IoT Solutions

TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power 0

Parameter Min Typ Max Unit
Operating Voltage 1.8 - 3.8 V
Operating Temperature -20 - +70

Current

Consumption

Sleep Mode - 1 - uA
Receive mode - 8 - mA
Transmit Mode - 27 - mA
TX Power (For Carrier) -   12 dBm
RX Sensitivity (For Lora Modulation) - - -121 dBm
Distance

434 / 470MHz:400-500

868 / 915MHz:600-800

m

 

Cansec Long Range AN1312 TI - CC1312 Sub-GHz IoT Module AES 256bits Low Power Consumption Module IoT Solutions

 

Description

The AN1312 module is designed based on CC1312R. The CC1312R device is a Sub-1GHz wireless MCU targeting Wireless M-Bus, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), KNX RF, Wi-SUN®, and proprietary systems, including theTI15.4-Stack.

The CC1312R device is a member of the SimpleLink™ MCU platform of cost-effective, ultra-low power,2.4-GHz and Sub-1 GHz RF devices. Very low active RF and microcontroller (MCU) currents, in addition to sub-μA sleep current with up to 80KB of parity protected RAM retention, provide excellent battery lifetime and allow operation on small coin-cell batteries and in energy-harvesting applications.

The CC1312R device combines a flexible, very low-power RF transceiver with a powerful 48-MHz Arm® Cortex®-M4F CPU in a platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Arm® Cortex®-M0) handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and great flexibility. The low power consumption of the CC1312R device does not come at the expense of RF performance; the CC1312R device has excellent sensitivity and robustness (selectivity and blocking) performance.

The CC1312R device is a highly integrated, true single-chip solution incorporating a complete RF system and an on-chip DC/DC converter. Sensors can be handled in a very low-power manner by a programmable, autonomous

ultra-low power Sensor Controller CPU with 4KB of SRAM for program and data. The Sensor Controller, with its fast wake-up and ultra-low-power 2 MHz mode is designed for sampling, buffering, and processing both analog and digital.

 

Feature Highlight
  • Built-in CC1312F Sub-1-GHz RF

System-On-Chip (SOC)

  • Size:15mm X 22mm X 3.2mm
  • Operating Voltage:1.8V to 3.8V
  • Operating Temperature: -20℃~+70℃
  • Storage Temperature: -40℃~+150℃
  • Microcontroller
  • Powerful 48-MHz Arm® Cortex®-M4F
  • Processor
  • 352KB of in-system Programmable Flash
  • 256KB of ROM for protocols and library

Functions

  • 8KB of Cache SRAM (Alternatively

available as general-purpose RAM)

  • 80KB of Ultralow Leakage SRAM
  • 2-Pin cJTAG and JTAG Debugging
  • Supports Over-the-Air Upgrade (OTA)
  • Ultralow Power Sensor Controller with 4KB of SRAM
  • Sample, store, and process sensor data
  • Operation independent from system CPU
  • Fast wake-up for low-power operation
  • TI-RTOS, drivers, Bootloader, and IEEE

802.15.4 MAC in ROM for optimized

application size

  • Peripherals
  • Digital peripherals can be routed to any

GPIO

  • 4× 32-bit or 8× 16-bit general-purpose

Timers

  • 12-Bit ADC, 200 ksamples/s, 8-Channel
  • 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
  • Programmable Current Source
  • 2 x UART
  • 2 x SSI (SPI, MICROWIRE, TI)
  • I2C
  • I2S
  • Real-Time Clock (RTC)
  • AES-128 - and 256-bit Crypto Accelerator
  • True Random Number Generator (TRNG)
  • Capacitive sensing, up to 8 channels
  • Integrated Temperature and battery monitor
  • Low Power
  • Active-Mode RX: 8mA
  • Active-Mode TX: 27mA
  • Standby: 1 μA (RTC on, 80KB RAM and

CPU retention)

  • Radio Section
  • Flexible high-performance sub-1 GHz RF

transceiver

  • Excellent receiver sensitivity:

-121 dBm for SimpleLink long-range

mode at 5 kbps;

-110 dBm at 50 kbps

  • Output power up to +14 dBm with

temperature compensation

 

 

TI CC1312 IoT AES 256 Bits Sub GHz Module 434/470/868/915MHz 13dBm TX Power 1

Pad Number Name Pin Type Description
1 GND Ground Pin Connect to GND
2 DIO_1 Digital I/O GPIO,
3 DIO_2 Digital I/O GPIO
4 DIO_3 Digital I/O GPIO
5 DIO_4 Digital I/O GPIO
6 DIO_5 Digital I/O GPIO, High drive capability
7 DIO_6 Digital I/O GPIO, High drive capability
8 DIO_7 Digital I/O GPIO, High drive capability
9 GND Ground Pin Connect to GND
10 VDD Power 1.8V to 3.8V main chip supply
11 DIO_8 Digital I/O GPIO
12 DIO_9 Digital I/O GPIO
13 DIO_10 Digital I/O GPIO
14 DIO_11 Digital I/O GPIO
15 DIO_12 Digital I/O GPIO
16 DIO_13 Digital I/O GPIO
17 DIO_14 Digital I/O GPIO
18 DIO_15 Digital I/O GPIO
19 JTAG_TMSC Digital I/O JTAG TMSC, High drive capability
20 JTAG_TCKC Digital I/O JTAG TCKC
21 DIO_16 Digital I/O GPIO, JTAG_TDO, High drive capability
22 DIO_17 Digital I/O GPIO, JTAG_TDI, High drive capability
23 DIO_18 Digital I/O GPIO
24 DIO_19 Digital I/O GPIO
25 DIO_20 Digital I/O GPIO
26 DIO_21 Digital I/O GPIO
27 DIO_22 Digital I/O GPIO
28 RESET_N Digital input Reset, active low. Internal pullup resistor
29 DIO_23 Digital/Analog I/O GPIO, analog capability
30 DIO_24 Digital/Analog I/O GPIO, analog capability
31 DIO_25 Digital/Analog I/O GPIO, analog capability
32 DIO_26 Digital/Analog I/O GPIO, analog capability
33 DIO_27 Digital/Analog I/O GPIO, analog capability
34 DIO_28 Digital/Analog I/O GPIO, analog capability
35 DIO_29 Digital/Analog I/O GPIO, analog capability
36 DIO_30 Digital/Analog I/O GPIO, analog capability
37 GND Ground Pin Connect to GND
38 ANT RF_OUT Antenna Type: NA RF_OUT
39 GND Ground Pin Connect to GND

 

Note: The MCU IOC can map a number of peripheral modules such as GPIO,

SSI (SPI), UART, I2C, and I2S to any of the available I/Os.

The peripherals AUX and JTAG are limited to specific I/O pins.More information please reference Ti.com.

 

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FAQ
Q1: Are you a factory or trade company?
A1: We are a professional factory with 25 years experience.
Q2: Can you accept OEM/ODM?
A2: Sure, we have rich OEM&ODM experience.
Q3: Do you have quality assurance?
A3; Each of our products has undergone quality testing and has two years of free after-sales service.

Contact Details
Beijing JiaAn Electronics Technology Co., Ltd.,

Contact Person: Sarolyn Kong

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